Solder Frames from Schnaidt. Highest manufacturing precision, customised to your requirements.
Ultra-fine SMD cover using titanium.
Industry-leading thermal management.
Material mix specially developed for the wave soldering process.
Significantly increased first-pass yield rate.
Our ergonomic hold-down system for checking THT components effectively prevents polarity reversal and placement errors.
Optimised set-up management.
Modular inserts and hold-down devices enable an increase in throughput of up to 25 %.
Significant reduction in the scrap rate.
The innovative tie rod system prevents twisting or bending of the solder mask.
Our individually designed soldering masks enable you to optimise set-up management and significantly increase the efficiency of your processes. Using the best materials, minimal tolerances and patented components guarantees an enormous improvement in your process quality.
Technical DataIndustry-leading thermal management.
Innovative thermal management effectively prevents thermal stress, material tension, overheating, component damage, twisting and deflection.
Individually customised to your product.
For example, bespoke hold-down systems enable components to be fixed in place to prevent them from floating due to the wave pressure or to check for the presence of position-coded components in order to avoid incorrect placement and thus reworking.
Optimal chamfer pattern.
Technical Data
At a glance.
Material
CDM®-ESD glass fibre material with up to 80,000 soldering cycles
Titanium
(dimensionally stable) aluminium, hard-coated
Titanium
(dimensionally stable) aluminium, hard-coated
Tie rod system
up to 0.05 mm flatness
Wall thickness
≥ 0.2 mm for titanium
Outer frame accuracy
up to 0.2 mm
Contact
Contact us for detailed information or individual solutions.
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