Solder frames from Schnaidt. Highest manufacturing precision, customised to your requirements.
most sophisticated SMD cover by means of titanium
Industry-leading thermal management
Specially for the wave soldering process developed material mix
Significantly increased first-pass yield rate
Our ergonomic hold-down system for checking THT components effectively prevents polarity reversal and placement errors.
Optimised set-up management
Modular inner kits and hold-down devices enable an increase in throughput of up to 25%.
Significant reduction in the scrap rate
The innovative tie rod system prevents twisting or bending of the solder mask.
Our individually designed soldering masks enable you to optimise set-up management and significantly increase the efficiency of your processes. Using the best materials, minimal tolerances and patented components guarantees an enormous improvement in your process quality.
Industry-leading thermal management
Innovative thermal management effectively prevents thermal stress, material tension, overheating, component damage, twisting and deflection.
customised to your product
Customised hold-down systems make it possible to hold components in place to prevent them from being swept up by the shaft pressure or to check for the presence of position-coded components in order to avoid incorrect placement and thus reworking.
Optimal chamfer pattern
technical data
At a glance
Material
CDM®-ESD glass fibre material with up to 80,000 soldering cycles Titanium (dimensionally stable) aluminium, hard-coated
Tie rod system
Up to 0.05 mm flatness
Wall thickness
≥ 0.2 mm for titanium
Outer frame accuracy
≥ 0.2 mm for titanium
Datasheet
Contact
Contact us for detailed information or customised solutions.
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